This can vary depending on the size of the RFQ, the number of components on the Bill Of Materials (BOM) and capacity in the quotes department at time of RFQ. Generally we aim to submit our quotation within 2-4 weeks after receiving an RFQ.

We would need a full data pack to be supplied, which should include Gerber files for the bare PCB and BOM (Bill of Materials), along with any assembly drawings and build instructions, where necessary, as well as the quantity that a quotation is required for.

We don’t offer any design capabilities ourselves but work closely with a company that can help with any design requirements you may have; we can then look at quoting on the electronics manufacturing side for prototypes through to production volumes.

This is something that can be discussed based on expected volumes.

We can manufacture typical batches from as little as 1 (prototype stage) up to 10,000.

Once all componentry has been received, the average lead time for manufacture can be between 2-4 weeks depending on batch quantity and number of components per assembly.

Componentry lead time in the current supply market generally varies from existing stock to 52 weeks in extreme cases. The lead time will be advised at the time of quotation, taking in consideration the lead time for components and the manufacture time.

All shop floor staff are IPC-A-610 class 3 certified and we are ISO 9001:2015 approved.

All surface mounted assemblies are 100% Automated Optical Inspection (AOI) tested and all through hole components also get a 100% visual inspection prior to being shipped out. Find out more about our inspection and testing processes here.

	Through Hole assembly	Surface Mount Technology (SMT)
Popularity	More prevalent in the assembly of larger electronic components, such as transformers, connectors, semiconductors and electrolytic capacitors.	The most widely used PCB assembly process. Most available electronic components can be mounted on circuit boards using this technology.
Process	Manual process but can also be automated. Pre-formed components are threaded through pre-drilled holes and soldered onto circuit boards, either by hand or using an automated process.	Fully automated process. Components are pasted and soldered to circuit boards, using fully automated production lines.
Features	Higher rated components are sometimes available compared to the surface mount counterparts.	Can be used to place components on both sides of a circuit board and it removes the need to drill holes through the PCB.
Advantages	Provides a more robust mechanical bond between the circuit board and the application which enhances strength and security, making it ideal for aerospace and defence applications, within equipment that withstands extreme stress and temperatures. It also has a fast and uncomplicated prototyping.	Perfect for the assembly of smaller, lighter, and more powerful PCBs that require a high degree of customisation. It also provides a greater uniformity of component soldering and allows for greater control of the width of route traces, which in turn reduces mechanical heat and noise, therefore improving the quality and performance of a product.

Fluid communication with our customers is always key to an efficient and seamless assembly process. We are very attentive to our customers’ specific requirements and we manufacture to your design. Therefore MPE does not decide whether we use surface mount or through-hole assembly. The PCB layout is totally different for each of the technologies, which means that we build what the customer has designed.