

enquiries@mpe-electronics.co.uk



About
PCB Assembly
- Surface Mount Technology
- Through Hole Assembly
  - Conventional Assembly
Box Build Assembly
Electronics Manufacturing Services
Sectors
Resources
- Blog
- Company News
- FAQS
- Glossary
- Guides
Contact

Overcoming EMI and EMC Challenges in PCB Assembly

Oct 2, 2023

Overcoming EMI and EMC Challenges in PCB Assembly

Recent Posts

Ball Grid Array: Types of BGAs & Their Importance in PCB Assembly
A look back at 2024: key factors that have shaped the PCB assembly and electronics sector
Types of electronic packaging
Advantages and disadvantages of surface mount technology
MPE Leads The Way With Eco-Friendly Packaging

Categories

Applications
Company News
Contract electronics manufacturing
Full box build assembly
General
PCB assembly
Potting & coating
Quality & compliance
Testing

Are you looking for your next Contract manufacturing partner?

submit an enquiry and one of our team will be in touch.

CONTACT US TODAY

Sign up for the MPE newsletter

Sign up for our quarterly e-newsletter, featuring industry news and insight, company news and information.

Name(Required)

First Last

Email(Required)

Please confirm you are human

Email

This field is for validation purposes and should be left unchanged.

Expert Services

PCB Assembly
Surface Mount Technology
Through Hole Assembly
Box Build Assembly
Logistics & Distribution
Electronics Packing

Useful links

Sectors
Quality
Capabilities
Case Studies
Blog
Careers

Website Terms of Use

T&Cs of Business

Copyright © 2025 | MPE Electronics. All rights reserved.

LWS Marketing : Website design, graphic design and marketing in Arundel, West Sussex

This website uses functional cookies which make it work and we also use marketing cookies to help us better understand website usage and make our service better. You can reject the marketing cookies if you wish. (Read More)